News


Technical Papers and Presentations

  • Via Reliability Analysis - In this interview, David Wolf discusses some of the trends he’s seeing in via structures, and the common reliability and quality issues related to vias.   Published by Andy Shaughnessy of PCBDesign007, November 2016.
  • PCB Sourcing Using PCQR2 - This paper and presentation discusses how PCB sourcing at National Instruments has been streamlined by removing subjectivity and ensuring that awarded PCB technology aligns with each supplier’s capability.  This change has resulted in an increase in quality, higher customer satisfaction, and dramatic cost savings to both National Instruments and the PCB supply base.   Published at IPC APEX in Las Vegas, NV by Al Block, Naji Norder and Chris Joran of National Instruments, March 2016.
  • What Will it Take to Make Micro-Section Acceptance/Rejection Criteria Obsolete? - This presentation focuses on advancing IPC specifications with new testing techniques that will reduce and/or eliminate traditional via hole micro-sections for printed board acceptance criteria.  Published at IPC APEX, February 2015.
  • Updated Database Standard Makes it Easier to Compare Printed Board Fabricator Capabilities - An in-depth discussion of the quantitative statistical techniques used by Conductor Analysis Technologies that distinguish one supplier or process from another.  Published by Terry Costlow, IPC online editor, May 2014.
  • Understanding Process Capability, Quality and Reliability - An in-depth discussion of the quantitative statistical techniques used by Conductor Analysis Technologies that distinguish one supplier or process from another.  Published by Conductor Analysis Technologies, Inc., January 2010.
  • Via Reliability – A Holistic Process Approach - The results of a case study from the IPC PCQR² Database which documents that both process capability and quality must be satisfied before initiating via reliability studies.  Relying on reliability studies alone can give a false indication of overall printed circuit board manufacturing capabilities.  Published at the SMTA International Conference in San Diego, CA by David Wolf of Conductor Analysis Technologies, Inc., October 2009.
  • Via Reliability Test Methods - Comparison data from three reliability test methods 1) dual chamber, 2) Highly Accelerated Thermal Shock (HATS), and 3) current induced (IST) is presented.  Published at IPC Works 2005 by Tim Estes of Conductor Analysis Technologies, Inc. and Vicka White of Honeywell, Inc., October 2005.
  • IPC's Process Capability, Quality and Relative Reliability (PCQR²) Database - Standardized PCB Benchmarking Data is Just a Mouse Click Away.  Published in IPC Review by David Bergman of IPC and David Wolf of Conductor Analysis Technologies, Inc., October 2005.
  • The Effect of Process Equipment on Fine-Line Uniformity - Information is presented on the sources of process non-uniformities including: laser direct imaging, photo-plotter resolution, and etching.  Published at IPC Printed Circuits Expo, March 2003.
  • Between The Conductors - From 1996 to 2005 Conductor Analysis Technologies, Inc. published a column in CircuiTree magazine related to printed circuit manufacturing process improvement and measuring printed circuit process capability, quality and reliability.  This document is a compilation of the most relevant columns.


Conductor and Space Designs

These designs are used to evaluate conductor and space process capability and quality.  Analysis reports from CAT document conductor and space yields, and conductor width and height control.  The designs may be copied, distributed, and used in their entirety, free of charge, provided that the "readme.txt" file is not altered and is included along with the Gerber files.

designs

Inner & Plated Layer Modules

                     


Dot Designs

These designs are used to evaluate exposure capability and uniformity, developer capability and uniformity, and photoresist adhesion through developing and etching processes.  The designs may be copied, distributed, and used in their entirety, free of charge, provided that the "readme.txt" file is not altered and is included along with the Gerber files.

Positive & Negative Modules

                   


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