The OM Thermal Stress System is an cost-effective performance based reliability test methodology which performs both convection reflow assembly simulation (IPC TM-650 2.6.27A) and air-to-air thermal cycling (IPC TM-650 2.6.7.2).  The methodology is utilized by both the IPC PCQR² and the IPC 6012-QML programs.  Applications include product acceptance, supplier qualification, design validation, material studies, and process verification.  OM systems are available for sale and test services are provided by CAT and our service partners.


OM Advantages

  • Coupon configurations
    • 24 IPC-2221B Appendix A type D
    • HATS, custom and non-electrical
  • Data Acquisition
    • 4-wire precision resistance
    • 1 reading/net every second during reflow simulation
    • 1 reading/net after hot side dwell during thermal cycling
  • Software
    • Automatic data analysis and report generation
    • Simple temperature profile generation
    • In situ calibration using external temperature standard
  • Web based IPC D coupon generator
  • Press-fit headers
    • No soldering or cleaning required


OM System


Example Reflow Simulation Data


Example Thermal Cycling Data


Acceptance Via Performance

Product board acceptance based on coupon performance, also know as performance based acceptance testing.  Example drawing notes for reflow simulation and thermal cycling:

  • IPC D COUPONS (2 PER MANUFACTURING PANEL) SHALL BE SUBJECTED TO 6 REFLOW SIMULATIONS IAW IPC-TM-650, METHOD 2.6.27 USING THE 230C PROFILE (TABLE 5-2).  ACCEPTANCE CRITERIA SHALL BE <5% CHANGE IN RESISTANCE.
  • AFTER REFLOW SIMULATION THE IPC D COUPONS (2 PER MANUFACTURING PANEL) SHALL BE SUBJECTED TO 250 THERMAL CYCLES IAW IPC-TM-650, METHOD 2.6.7.2 FROM -55C TO +125C.  ACCEPTANCE CRITERIA SHALL BE <10% CHANGE IN RESISTANCE.


Service Partners

                    




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