The OM Thermal Stress System is a performance based reliability test methodology which performs:


OM Advantages

  • IPC-2221B Appendix A type D coupons
    • Web based generator
    • 0.550" x 1.875"
    • Thickness up to 0.300"
  • Press-fit headers
    • No soldering or cleaning required
  • Data Acquisition
    • 4-wire precision resistance
    • 1 reading per net every second
    • 24 coupons per chamber load
  • Software
    • Automatic data analysis and report generation
    • Simple temperature profile generation
    • In-situ temperature calibration using external standard


OM Reflow Simulation Data



OM Thermal Shock Data



IPC Microvia Reliability Warning (Read full Press Release)

“There have been many examples of post fabrication microvia failures over the last several years.  Typically, these failures occur during reflow, however they are often undetectable (latent) at room temperature.  The further along the assembly process that the failures manifest themselves the more expensive they become. If they remain undetected until after the product is placed into service, they become a much greater cost risk, and more importantly, may pose a safety risk.”

“Many of these failures occurred within products that had already passed traditional production lot acceptance testing in accordance with existing IPC-6010, Printed Board Qualification and Performance Specifications.  IPC has been provided with data showing that traditional inspection techniques utilizing thermally stressed microsections and light microscopes alone is no longer an effective quality assurance tool for detecting microvia-to-target plating failures.”

Note: The OM Thermal Stress System was specifically designed to detect these types of failures!


Product Acceptance Drawing Notes

IPC D COUPON TESTING

A.  IPC D COUPONS SHALL BE DESIGNED USING THE COUPON GENERATOR AT WWW.CAT-TEST.INFO.  COUPONS SHALL INCLUDE COMPONENT (A), VIA (B) AND ALL PROPAGATED B STRUCTURES IAW IPC-2221B APPENDIX A.  4 OF EACH COUPON DESIGN SHALL BE TESTED PER MANUFACTURING PANEL.  ACCEPTANCE SHALL BE BY PANEL.

B.  THE IPC D COUPONS SHALL BE SUBJECTED TO 6 REFLOW SIMULATIONS IAW IPC-TM-650, METHOD 2.6.27 USING THE [230C, OR 245C, OR 260C] PROFILE.  ACCEPTANCE CRITERIA SHALL BE <5% CHANGE IN RESISTANCE.  

C.  AFTER REFLOW SIMULATION THE IPC D COUPONS SHALL BE SUBJECTED TO 100 THERMAL SHOCKS IAW IPC-TM-650, METHOD 2.6.7.2 FROM -55C TO [MINIMUM OF (LAMINATE TG - 10C), OR (REFLOW PEAK TEMPERATURE - 25C), OR 210C].  THE LAMINATE TG SHALL BE DETERMINED FROM THE LOWEST VALUE REPORTED FROM THE MATERIAL SUPPLIERS DATA SHEET.  ACCEPTANCE CRITERIA SHALL BE <5% CHANGE IN RESISTANCE.

D.  RESISTANCE MEASUREMENTS SHALL BE MONITORED AT LEAST EVERY SECOND DURING REFLOW SIMULATION AND AT LEAST ONCE PER CYCLE DURING THERMAL SHOCK.

E.  RESULTS FROM ALL D COUPONS TESTED SHALL BE REPORTED.

F.  MICRO-SECTIONING OF THE D COUPONS AFTER TESTING IS NOT REQUIRED.

Note:  Parameters in red should be tailored to each application.




Copyright © 1994 - 2021 Conductor Analysis Technologies, Inc.