News
April 22, 2021 - Summit Interconnect Anaheim Opens New State-of-the-Art Laboratory
November 7, 2019 - CAT Announces Shipments of Second Generation OM Thermal Stress Systems
October 3, 2019 - Conductor Analysis Technologies Ships Second Generation OM Thermal Stress System
March 6, 2019 - IPC Issues Electronics Industry Warning on Printed Board Microvia Reliability
Technical Papers, Presentations & Articles
Performance Based Microvia Reliability Testing - What You Need to Know
A discussion of performance based reliability testing based on IPC TM-650 2.6.27B by Lance A. Auer, Timothy A. Estes and Nicholas J. Meeker at IPC Microvia Summit 2020.
Microvia Reliability in Ultra-High Density Interconnect Designs
An intervirew with Jim Brown of GreenSource Fabrication by Judy Warner of Altium at IPC APEX February 2020.
Understanding Process Capability, Quality and Reliability
An in-depth discussion of the quantitative statistical techniques used by Conductor Analysis Technologies that distinguish one supplier or process from another. Published by Conductor Analysis Technologies, Inc., January 2010.
The Effect of Process Equipment on Fine-Line Uniformity
Information is presented on the sources of process non-uniformities including: laser direct imaging, photo-plotter resolution, and etching. Published at IPC Printed Circuits Expo, March 2003.
From 1996 to 2005 Conductor Analysis Technologies, Inc. published a column in CircuiTree magazine related to printed circuit manufacturing process improvement and measuring printed circuit process capability, quality and reliability. This document is a compilation of the most relevant columns.
Conductor and Space Designs
These designs are used to evaluate conductor and space process capability and quality. Analysis reports from CAT document conductor and space yields, and conductor width and height control. The designs may be copied, distributed, and used in their entirety, free of charge, provided that the "readme.txt" file is not altered and is included along with the Gerber files. Download
Dot Designs
These designs are used to evaluate exposure capability and uniformity, developer capability and uniformity, and photoresist adhesion through developing and etching processes. The designs may be copied, distributed, and used in their entirety, free of charge, provided that the "readme.txt" file is not altered and is included along with the Gerber files. Download
