The IPC Process Capability, Quality and Reliability Program is a unique supply chain management resource, developed by IPC and Conductor Analysis Technologies for designers, manufacturers, and users of printed circuit boards.  The program is based on statistical data collected from industry-developed test patterns which quantifies the capability, quality and reliability of printed board manufacturers.


Program Applications

  • Benchmark board suppliers' capabilities
  • Perform intelligent sourcing
  • Select new suppliers
  • Ensure design for manufacturability
  • Establish realistic design rules


Program Subscribers

  • BAE Systems
  • Dell Inc.
  • Harris Corporation
  • HELLA GmbH & Co. KGaA
  • Honeywell International Inc.
  • IEC Electronics Corporation
  • Intel Corporation
  • National Instruments Corporation
  • NSWC Crane
  • NVIDIA Corporation
  • Raytheon Company
  • Sandia National Laboratories
  • Texas Instruments


Subscriber Testimonials


Example Supplier Comparison


Test Panel Designs

The process capability panel designs were developed by the IPC D-36 Subcommittee, and are provided under license to IPC for use by its members and the printed circuit board community.  The designs are to be used exclusively for the support of the IPC PCQR² Database.

The designs incorporate the following structures in order to provide relevant statistics on the capability, quality, and reliability of the process used in their manufacture:

  • Conductor/space capability
    • Outerlayer
    • 0.5 oz innerlayer
    • 1.0 oz innerlayer
    • Plated innerlayer
  • Via registration, capability and reliability
    • Through
    • Blind
    • Stacked
    • Staggered
    • Stacked over sub-composite
    • Staggered over sub-composite
  • Soldermask registration
  • Controlled impedance
    • Surface microstrip
    • Stripline
  • Internal elecrto-migration
  • Cross-sections


Test Panel Designs Revisions (The latest revision must be used for all new submissions)

  • IPC-8
    • Stackup
    • Gerber data: December 1, 2017
    • Requirements file: September 17, 2018
  • IPC-10
    • Stackup
    • Gerber data: May 21, 2019
    • Requirements file: May 21, 2019
  • IPC-12
    • Stackup
    • Gerber data: December 1, 2017
    • Requirements file: September 17, 2018
  • IPC-18
    • Stackup
    • Gerber data: March 13, 2018
    • Requirements file: September 17, 2018
  • IPC-24
    • Stackup
    • Gerber data: September 14, 2017
    • Requirements file: September 17, 2018
  • IPC-24B
    • Stackup
    • Gerber data: February 12, 2019
    • Requirements file: February 12, 2019


Supplier List For Last 36 Months



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