The IPC Process Capability, Quality and Reliability Program is a unique supply chain management resource, developed by IPC and Conductor Analysis Technologies for designers, purchasers, assemblers and manufacturers of printed boards.  The program is based on statistical data collected from industry-developed test patterns which quantifies the capability, quality and reliability of printed board manufacturers.

Program Applications

  • Benchmark your board suppliers' capabilities
  • Perform intelligent sourcing
  • Select new suppliers
  • Ensure design for manufacturability
  • Establish realistic design rules

Program Subscribers

  • BAE Systems
  • Bose Corporation
  • Dell Inc.
  • Harris Corporation
  • HELLA GmbH & Co. KGaA
  • Honeywell International Inc.
  • IEC Electronics Corporation
  • Intel Corporation
  • MIT Lincoln Laboratory
  • National Instruments Corporation
  • NSWC Crane
  • NVIDIA Corporation
  • Raytheon Company
  • Sandia National Laboratories

Subscriber Testimonials

Example Supplier Comparison

Example Cross-Section (click for interactive image)

Test Panel Designs

The process capability panel designs were developed by the IPC D-36 Subcommittee, and are provided under license to IPC for use by its members and the printed circuit board community.  The designs are to be used exclusively for the support of the IPC PCQR² Database.

The designs incorporate the following structures in order to provide relevant statistics on the capability, quality, and reliability of the process used in their manufacture:

  • Outerlayer conductor/space capability
  • Innerlayer conductor/space capability
  • Via registration, capability and reliability
  • Soldermask registration
  • Controlled impedance
  • Internal elecrto-migration
  • Cross-sections

Test Panel Designs Revision Dates (The latest revision must be used for all new submissions)

  • IPC-8
    • Gerber data: December 1, 2017
    • Requirements file: September 17, 2018
  • IPC-10
    • Gerber data: October 12, 2017
    • Requirements file: September 17, 2018
  • IPC-12
    • Gerber data: December 1, 2017
    • Requirements file: September 17, 2018
  • IPC-18
    • Gerber data: March 13, 2018
    • Requirements file: September 17, 2018
  • IPC-24
    • Gerber data: September 14, 2017
    • Requirements file: September 17, 2018

8 Layer Standard Design Stackup Schematics

10 Layer Buildup Design Stackup Schematic


12 Layer Standard Design Stackup Schematics

18 Layer Standard Design Stackup Schematics

24 Layer Standard Design Stackup Schematics

Supplier List For Last 36 Months

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